パナソニック・ホーム
バイポーラICパッケージ
| Surface-mount type (SMD) |
Single type | SIP (Single Inline Package) |
HSIP | |||||
|---|---|---|---|---|---|---|---|---|
| Dual type | SOP (Small Outline Package) |
SOP | SSOP | HSOP | ||||
| Quad type | QFP (Quad Flat Package) |
QFP | LQFP | HQFP | TQFP | |||
| QFH (Quad Flat High Package) |
QFH | |||||||
| QFN (Quad Flat Non-leaded Package) |
QFN | HQFN | ||||||
| Area array type |
BGA (Ball Grid Array Package) |
P-BGA (UBGA) | ||||||
| WLCSP (XBGA) | ||||||||
| LGA (Land Grid Array Package) |
L-CSP (MLGA,ULGA,XLGA) | |||||||
| Others | ||||||||
| Through-hole type (THD) |
Single type | SIP (Single Inline Package) |
SIP | SSIP | HSIP | |||
| ZIP (Zigzag Inline Package) |
HZIP | |||||||
| Dual type | DIP (Dual Inline Package) |
DIP | SDIP | HDIP | ||||
