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Electronic Components

The biggest strength of the Electronic Components Business Unit of Panasonic Semiconductor Solutions is its strategy of incorporating a complete production system, ranging from mold design and fabrication to high-precision pressing, various functional plating, and precision injection molding. Its light-emitting diode packages, the products that represent the Electronic Components Business Unit, are a concentrate of this strength.
Integrating our high-speed pressing technology for producing precision semiconductor lead frames realized from submicron-order mold precision and ultra-precision, high-level mold design and fabrication featuring a pressing precision of less than 2 µm, the state-of-the-art plating technologies including palladium plating and in-house developed high-reflection, discoloration-free silver plating that features excellent resistance to discoloration and corrosion, and molding technologies that use high-polymer chemistry, we produce highly sophisticated, high-quality packages, which are used in many LED package applications, including automotive products, liquid crystal displays, and general lighting products.
Integrating our proprietary technologies that have resulted in such products as molded substrates mode from thermosetting resins and hermetic seal components, we intend to further sophisticate our new technologies and engineering methods, thereby presenting technological innovations capable of improving customer satisfaction on an ongoing basis.

Lead Frame Components

for LED, IC, LSI, Discrete, Spring components by fine stamping process

Various Molded Components

for LED, Optical-pickup components, Sensor components, Automotive components

Hermetic Seal Components

for LED, Sensor components, other

LED Packages

LED Packages

Various Molded Components

Various Molded Components

Lead Frame Components

Lead Frame Components

Hermetic Seal Components

Hermetic Seal Components

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